If you’re responsible for hardware development and need to embed FOUNDATION Fieldbus (FF), PROFIBUS PA or PROFINET over Ethernet-APL into your field device, then one of these chips may offer a solution.
You can add new physical layers to your existing Modbus or HART field devices using either the Softing commModule MBP or commModule APL.
The commModule MBP lets you modify your device’s circuit board to enable FF or PROFIBUS PA communications, while the commModule APL lets you reuse your circuit board to enable PROFINET over the new Ethernet Advanced Physical Layer (Ethernet-APL) network.
Both the commModule MBP and commModule APL are compact, surface-mountable circuit boards that can communicate with your device’s existing Modbus or HART interface.
Each board is pre-certified for its target physical layer and includes a protocol stack and function blocks. You can also integrate these boards into the field device application without any software coding.
